Program at a Glance

KST	EEST Athens	CEST (CET) Paris	UTC	EDT New York	PDT Los Angeles

Program at a Glance Program Details

Click the session code to see detailed schedules.
Last update : November 13, 2023 (KST)

Nov. 19 (Sun.)	Time	Room A  (Capri Room, 2F)	Room E  (Sydney Room, 2F)	2F Lobby
	15:00-18:00	Tutorial 1 - Korean Only	Tutorial 2  - Korean Only
		Memory Process and Materials Technology: DRAM, NAND, Emerging Memory Dr. Jeongdong Choe (Techlnsights, Canada)	Atomic Layer Deposition and Area-Selective Deposition in Semiconductor Process Prof. Il-Kwon Oh (Ajou Univ., Korea)
	18:00-18:30	Break
	18:30-20:00	Welcome Reception (Sicily Room, 1F)

Plenary Session will be live streamed at Sydney Room (2F) and Sicily Room (1F).

Nov. 20 (Mon.)	Time	Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 2, 2F)	Room D (Grand Ballroom 3, 2F)	Room E (Sydney Room, 2F)	Room F (Sicily Room, 1F)	2F Lobby
	10:00-10:45	Plenary Session I (Capri Room, 2F) "Memory Technology Innovation for the New AI Era" SVP. Ilsup Jin (SK hynix, Korea)						Exhibition
	10:45-11:00	Coffee Break (2F Lobby)
	11:00-11:30	Opening Ceremony (Grand Ballroom 1, 2, 3, 2F)
	11:30-13:00	Lunch
	13:00-14:40	MA1	MB1	MC1	MD1	ME1	MF1
		Advanced Atomic Scale Thin Films Ⅰ	Power Device I	Advanced Ceria-Abrasive Based CMP	Novel Etch Technology	EUV Lithography I	Frontier Metrology and Modeling I
	14:40-14:55	Coffee Break (2F Lobby)
	14:55-16:35	MA2	MB2	MC2	MD2	ME2	MF2
		Advanced Atomic Scale Thin Films Ⅱ	Power Device II	CMP Challenges for the Next Generation Devices	Plasma-Surface Interaction	EUV Lithography II	Frontier Metrology and Modeling II
	16:35-16:50	Coffee Break (2F Lobby)
	16:50-17:40	Poster Session I (Grand Ballroom 4, 2F)

Nov. 21 (Tue.)	Time	Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 2, 2F)	Room D (Grand Ballroom 3, 2F)	Room E (Sydney Room, 2F)	Room F (Sicily Room, 1F)	2F Lobby
	08:30-10:10	TA1	TB1	TC1	TD1	TE1	TF1	Exhibition
		Advanced Atomic Scale Thin Films Ⅲ	Heterogeneous Integration Device and Packaging	Challenges and Opportunities in CMP	Plasma Characterization	DTCO and Computational Lithography	Frontier Metrology and Modeling III
	10:10-10:20	Coffee Break (2F Lobby)
	10:20-12:00	TA2	TB2	TC2	TD2	TE2	TF2
		Advanced Atomic Scale Thin Films Ⅳ	Integration and Interposer	Advanced Cu and Mo CMP	Plasma/Etch Simulation	EUV Resist & Advanced Lithography for Optical Materials	Frontier Metrology and Modeling IV
	12:00-13:30	Lunch
	13:30-14:15	Plenary Session II (Capri Room, 2F) "New Precursors and Approaches to ALD and AS-ALD of Metallic Films" Prof. Mikko Ritala (Univ. of Helsinki, Finland)
	14:15-14:25	Coffee Break (2F Lobby)
	14:25-16:05	TA3	TB3	TC3	TD3	TE3	TF3
		Advanced Atomic Scale Thin Films Ⅴ	Process and Equipment	CMP Innovations	HARC Etching/Green Etch Technology	EUV HVM Status and Cutting-Edge Topics in Advanced Lithography	Frontier Metrology and Modeling V
	16:05-18:30	Break
	18:30-20:30	Banquet (Grand Ballroom, 2F)

Nov. 22 (Wed.)	Time	Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 2, 2F)	Room D (Grand Ballroom 3, 2F)	Room E (Sydney Room, 2F)	Room F (Sicily Room, 1F)	2F Lobby
	08:30-10:10	WA1	WB1	WC1	WD1	WE1	WF1	Exhibition
		Advanced Atomic Scale Thin Films Ⅵ	Materials and Innovation	Functional Wet Etching Technology	New Materials Etching	Advanced Lithography for Future Optical Devices I	Frontier Metrology and Modeling VI
	10:10-10:20	Coffee Break (2F Lobby)
	10:20-12:00	WA2		WC2	WD2	WE2
		Advanced Atomic Scale Thin Films Ⅶ		Advanced Cleaning Technology	Atomic Layer Etching/Damage-Free Etching	Advanced Lithography for Future Optical Devices II
	12:00-13:30	Lunch
	13:30-14:15	Plenary Session III (Capri Room, 2F) "EUV Lithography in High Volume Manufacturing" Fellow, Young Seog Kang (Samsung Electronics Co., Ltd., Korea)
	14:15-14:30	Coffee Break (2F Lobby)
	14:30-15:20	Poster Session II (Grand Ballroom 4, 2F)
	15:20-15:35	Coffee Break (2F Lobby)
	15:35-16:05	Closing Ceremony & Award Ceremony (Capri Room, 2F)

Nov. 23 (Thu.)	Time	Room A (Capri Room, 2F)	Room B (Grand Ballroom 1, 2F)	Room C (Grand Ballroom 2, 2F)	Room D (Grand Ballroom 3, 2F)	Room E (Sydney Room, 2F)	Room F (Sicily Room, 1F)	2F Lobby
	(Half) 08:30-12:00 (Full) 08:30-17:30	Optional Tour