Memory Technology Innovation for the New AI Era
SVP. Ilsup Jin
SK hynix, Korea
New Precursors and Approaches to ALD and AS-ALD of Metallic Films
Prof. Mikko Ritala
Univ. of Helsinki, Finland
EUV Lithography in High Volume Manufacturing
Fellow, Young Seog Kang
Samsung Electronics Co., Ltd., Korea
Elevating Atomic Layer Deposition to the Angstrom Era
Prof. Erwin Kessels
Eindhoven Univ. of Tech., The Netherlands
A Holistic Approach to Optimizing Chemical Mechanical Planarization (CMP) for Enhanced Semiconductor Manufacturing and Sustainability
Prof. Jihoon Seo
Clarkson Univ., USA
Low Temperature Plasma-Materials Interactions for Plasma Etching
Prof. Gottlieb S. Oehrlein
Univ. of Maryland, USA
EUV Systems for High Volume Manufacturing
Dr. Stuart Young
ASML, The Netherlands
Patterning and Metrology Challenges in EUV Lithography
Dr. Victor M. Blanco Carballo
IMEC, Belgium
On the Origin of Gate Oscillation of Power Devices
Prof. Hyemin Kang
KENTECH, Korea
