Plenary Speakers

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Memory Technology Innovation for the New AI Era

New Precursors and Approaches to ALD and AS-ALD of Metallic Films

EUV Lithography in High Volume Manufacturing

1. Advanced Atomic Scale Thin Films

    Elevating Atomic Layer Deposition to the Angstrom Era

  • Prof. Erwin Kessels

    Eindhoven Univ. of Tech., The Netherlands

2. CMP & Post CMP Cleaning

    A Holistic Approach to Optimizing Chemical Mechanical Planarization (CMP) for Enhanced Semiconductor Manufacturing and Sustainability

  • Prof. Jihoon Seo

    Clarkson Univ., USA

3. Advanced Etching Technology

    Low Temperature Plasma-Materials Interactions for Plasma Etching

  • Prof. Gottlieb S. Oehrlein

    Univ. of Maryland, USA

4. Advanced Lithography

    EUV Systems for High Volume Manufacturing

  • Dr. Stuart Young

    ASML, The Netherlands

6. Frontier Metrology, Diagnosis, and Modeling for Nanoscale IC Integration and Emerging Device Process

    Patterning and Metrology Challenges in EUV Lithography

  • Dr. Victor M. Blanco Carballo

    IMEC, Belgium

7. Power Device

    On the Origin of Gate Oscillation of Power Devices

  • Prof. Hyemin Kang

    KENTECH, Korea


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