Invited Speakers
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- Invited Speakers
1. Advanced Atomic Scale Thin Films
Challenges and Requirements of ThinFilm Technology In the Era of Moore’s Law Extension and Beyond
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Ms. Jinhee Park
SK hynix, Korea
The advancements of Atomic Scale Interface Engineering for High Quality Dielectric Thin Films
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Dr. Chunhyung Chung
Samsung Electronics Co., Ltd.
, Korea
Molybdenum Precursors and Deposition Mechanisms
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Prof. Sean Barry
Carleton Univ., Canada
Spontaneous Surface Reactions in Atomic Layer Deposition of Platinum using Atomic Hydrogen as a Reactant
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Dr. Hao Van Bui
Phenikaa Univ., Vietnam
Memtransistor Devices based on 2D Layered Semiconductor for Energy-Efficient Neuromorphic Computing
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Prof. Byungjin Cho
Chungbuk Nat'l Univ., Korea
Area-Selective Deposition on Features with Nanoscale Dimensions for Semiconductor Device Manufacturing
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Dr. Annelies Delabie
IMEC, Belgium
Ozone Concentration Dependence of Tetragonal Phase of ZrO2
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Prof. Hyeongtag Jeon
Hanyang Univ., Korea
Advanced Process Technologies for Future Logic Devices
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Mr. Honggun Kim
TEL Korea, Korea
Combined Atomic Layer Deposition and Etching Process towards Advanced Atomic Level Patterning
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Prof. Woo Hee Kim
Hanyang Univ., Korea
Effect of Surface Pre-Treatment on the Initial Growth Stages of ALD-Ir Thin Films
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Prof. Se Hun Kwon
Pusan Nat'l Univ., Korea
Atomic Layer Deposition of Silicon Oxide Films Using Tris(dimethylamino)silane and Ozone
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Prof. Won-Jun Lee
Sejong Univ., Korea
Pt Thin Films by Atomic Layer Deposition Using Dimethyl(N,N-Dimethyl-3-Buten-1-Amine-N) Platinum and O2 Reactant towards the Semiconductor Application
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Prof. Woo-Jae Lee
Pukyong Nat'l Univ., Korea
The Improvement of Interfacial Properties of MIM Capacitors
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Prof. Woongkyu Lee
Soongsil Univ., Korea
Atomistic Modeling of Electronics and Thermodynamics of Defects on Titania Surfaces under Environmental Condition
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Dr. Ngoc Linh Nguyen
Phenikaa Univ., Vietnam
Spatial Atomic Layer Deposition of Functional Thin Films
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Dr. Viet Huong Nguyen
Phenikaa Univ., Vietnam
Atomic Layer Deposition for Nanoscale Oxide Semiconductor Field Effect Transistors: Four Values and Outlook
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Prof. Jin-Seong Park
Hanyang Univ., Korea
Development of Material Systems and Processes for Highly-Reliable ULSI-Cu Interconnec
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Prof. Yukihiro Shimogaki
The Univ. of Tokyo, Japan
Hybrid Multilayer EUV Photoresist for 1.5 Technology Node
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Prof. Myung Mo Sung
Hanyang Univ., Korea
Advanced Deposition Materials for Atomic Layer Deposition and Beyond
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Dr. Changbong Yeon
Soulbrain Co., Ltd., Korea
SMART Metallization for Reliable and Power-Efficient Hetero-Integrated Systems
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Prof. Hanwool Yeon
GIST, Korea
2. CMP & Post CMP Cleaning
Enhancing Advanced Memory Development through CMP Innovations
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Dr. Hyo-Chol Koo
SK hynix, Korea
CMP Challenges and Opportunities for the Next Generation Logic Devices
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Dr. Hoyoung Kim
Samsung Electronics Co., Ltd.,
Korea
Challenges and Opportunities in CMP for More Than Moore Innovation
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Prof. Haedo Jeong
Pusan Nat'l Univ., Korea
Surface Modified Nanoparticle Abrasives for Efficient CMP Process
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Prof. Tae-Dong Kim
Hannan Univ., Korea
New Cleaning and Etch Solution Approaches for Advanced sub 5nm Technology Nodes
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Dr. Andreas Klipp
BASF, Germany
BOE-Based High Selective SiO2 Etching Technology Applicable to Next-Generation Semiconductor Manufacturing Process
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Mr. Myung Ho Lee
ENF Technology Co., Ltd., Korea
Surface Preparation for InGaAs MOSFET Fabrication
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Prof. Sangwoo Lim
Yonsei Univ., Korea
Polishing Mechanism on Ceria/SiO2 Interface
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Dr. Satoyuki Nomura
Resonac Corp., Japan
Enhancing Planarity and Defect Management in Chemical Mechanical Planarization (CMP) Slurry for Advanced Middle-of-Line (MOL) Semiconductor Processes
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Prof. Ungyu Paik
Hanyang Univ., Korea
New Approach for Enhancing Cu CMP Performance Vi a. Radical Oxidation
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Prof. Jea-Gun Park
Hanyang Univ., Korea
Amorphous-Carbon-Layer CMP Mechanism: Dependencies of Polishing-Rate on Film Hardness, Abrasive Material and Abrasive Diameter
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Mr. Jinhyung Park
UBM, Korea
3. Advanced Etching Technology
Green Technologies in Advanced Etching Process
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Dr. Huichan Seo
SK hynix, Korea
Extendable Etch Solutions for Sub 10-nm DRAM Device
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Dr. Kukhan Yoon
Samsung Electronics Co., Ltd., Korea
Plasma-Enhanced Atomic Layer Etching for Metals and Dielectric Materials
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Prof. Heeyeop Chae
Sungkyunkwan Univ., Korea
Cryogenic Etching Processes Applied to the Next Generation of Nanoelectronic Technologies
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Prof. Remi Dussart
Univ. d’Orléans, France
Implementation of a Plasma-Based Integrated System for Synthesis, Etching, Machine-Learning of 2D TMDc
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Dr. Hyeong-U Kim
KIMM, Korea
Etching Mechanism of Amorphous Hydrogenated Silicon Nitride by Hydrogen Fluoride
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Prof. Won-Jun Lee
Sejong Univ., Korea
4. Advanced Lithography
Memory OPC Technology Development History and Future Strategy
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Dr. Sungwoo Ko
SK hynix, Korea
High NA EUV: Eco Systems & Requirements
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Dr. Chang-Min Park
Samsung Electronics Co., Ltd.,
Korea
EUV Application for Memory Devices
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Dr. Changhyun Cho
ex-SK hynix & SEC, Korea
Deciphering Line Edge Roughness Formation in EUV Patterning: Insights from Molecular Simulations and Strategies for Minimization
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Prof. Su-Mi Hur
Chonnam Nat'l Univ., Korea
Thermal Emission Steering and Mid-IR Complex Amplitude Modulation with Graphene-Based Active Metasurfaces
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Prof. Min Seok Jang
KAIST, Korea
Recent Advances in Inorganic EUV Photoresist
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Prof. Myung-Gil Kim
Sungkyunkwan Univ., Korea
Advanced on-demand Micro-Transfer Printing Techniques for Seamless Integration of Nanophotonic and Metasurface Devices
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Prof. Myung-Ki Kim
Korea Univ., Korea
Evolution of Photolithography and Patterning Paradigms: Navigating into the DTCO and STCO Scaling Era
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Dr. Ryoung-han Kim
IMEC, Belgium
EUV OPC in High High-NA Extreme Ultraviolet Lithography
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Dr. Young-Chang Kim
Siemens EDA, USA
Dielectric Metasurfaces for Optical Field Imaging Devices and Optimized Photonic Devices
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Dr. Hyounghan Kwon
KIST, Korea
Lithography Modeling with Machine Learning Techniques
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Dr. Yonghwi Kwon
Synopsys, Inc., USA
On-Chip Ultra-Low-Loss Optical Components for Mid-Infrared Photonics
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Prof. Hansuek Lee
KAIST, Korea
Synchrotron Based Actinic EUV Metrology and Inspection Technologies
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Prof. Sangsul Lee
POSTECH, Korea
Low-Cost and Scalable Manufacturing of Optical Metasurfaces in the Visible Using Engineered Optical Materials (PER, Low-Loss a-Si:H, and Hybrid ALD Structural Resin)
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Prof. Junsuk Rho
POSTECH, Korea
EUV R&D Activity at NewSUBARU
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Prof. Takeo Watanabe
Univ. of Hyogo, Japan
Development of High-Efficiency EUV Zoneplate for Advanced EUV Lithography Equipment
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VP. Jebum Yoon
ESOL, Inc., Korea
5. Post Fabrication Technology and System Packaging
Technology Trend of the interposer for 2.5D SiP
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Dr. Minsuk Suh
SK hynix, Korea
Advanced Packaging Technology for Heterogeneous Integration
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Dr. Seok Hyun Lee
Samsung Electronics Co., Ltd.,
Korea
Advanced Packaging Materials and Evaluation Platform at Resonac
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Dr. Hidenori Abe
Resonac Corp., Japan
High-Performance TiO2/ZrO2/TiO2 Thin Film Capacitor by Plasma-Assisted Atomic Layer Annealing
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Prof. Jihwan An
POSTECH, Korea
Challenge Again for Latest Logic Semiconductor and Packaging Device
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Dr. Takao Enomoto
Rapidus Inc., Japan
Adhesion of Plated Thick Film Metal on Epoxy Molding Compound under Thermal Cycle
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Dr. Jae-Seong Jeong
KETI, Korea
2.5D Interposer Technologies for Heterogeneous Integration
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Porf. Gu-Sung Kim
Kangnam Univ., Korea
Glass Wafer for Supporting Semiconductors
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Mr. Masahiro Kobayashi
Nippon Electric Glass Co., Ltd.,
Japan
Fluidic Self-Assembly Packaging: The Future of Microchip Transfer Technologies in MicroLED Display
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Prof. Daewon Lee
Myongji Univ., Korea
Development of Heterogenous and Multi-Stack Flexible Packaging with Photo-Patternable Polymer Elastic Bumps
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Dr. Hyunkyu Moon
KIMM, Korea
Metal-Oxide Based Thermal Interface Materials for Improvement of Heat Transfer Characteristics
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Porf. Jinsub Park
Hanyang Univ., Korea
Development Trends of Plasma System and Applications in Semiconductor Packaging and Substrate
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Porf. Nam Son Park
Tech Univ. of Korea, Korea
Supply Chain Trends, Challenges, and Disruptions in Semiconductor Packaging
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Dr. Kitty Pearsall
IEEE EPS, USA
Enabling Power Efficiency, Scaling, and Economics with Chiplets
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Ms. E. Jan Vardaman
TechSearch International, Inc., USA
Low-CTE Epoxy Resin for the Semiconductor Packaging
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Mr. Dae-bong Yoon
Samhwa Paints Ind Co., Ltd., Korea
6. Frontier Metrology, Diagnosis, and Modeling for Nanoscale IC Integration and Emerging Device Process
Important Role of Nano-Scale Metrology for Next Generation Device Manufacturing
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Dr. Jae-hyun Kim
SK hynix, Korea
3D Gray Level Index for Pattern Depth Monitoring Using SEM Image
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Dr. Younghoon Sohn
Samsung Electronics Co., Ltd., Korea
Inline Convergence AFM Solutions for Advanced Packaging
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Dr. Sang-Joon Cho
Park Systems Corp., Korea
Improved Semiconductor Nanodevice Metrology with Next Generation Atom Probe
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Dr. Devin Giddings
AMETEK, UK
Atomistic Simulation of Semiconductor Processing Using Machine Learning Potentials
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Prof. Seungwu Han
Seoul Nat'l Univ., Korea
Local Probe Microscopy: A Potential Tool for Material Characterization at Nanoscale
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Prof. Mohit Kumar
Ajou Univ., Korea
MI’s Direction for Next Journey
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Dr. Byoung-Ho Lee
Hitachi-hightech, Korea
Adaptive Optics for Optical Metrology & Inspection
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Prof. Jun Ho Lee
Kongju Nat'l Univ., Korea
Methodology for Efficient Monitoring of Semiconductor Processes in Very Low Volume Manufacturing (VLVM)
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Dr. Tae Yong Lee
IMEC, Belgium
Analysis Theory and Method of Single Particle ICP-MS
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Mr. Jaehong Park
Agilent, Korea
The Optical System and Analysis for Thickness and Transition Zone Measurement of Epitaxial Layer
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Mr. Yoonjong Park
SEMILAB Korea, Korea
Spectroscopically Resolved Electronic Band Structures of Ultrathin Oxide Layers and Interfaces for Advanced ICs and IGZO-based TFTs
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Porf. Hyungtak Seo
Ajou Univ., Korea
Laser COOL Forming1 TGV for Glass Substrate of Semiconductor Packaging and Laser COOL Cut1 without Crack for Wafer(SiC, GaN, TSV, Sapphire)
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CEO. Taegeun Kim
Cubixel Inc., Korea
Flying-over Scanning Holography for Industrial Inspection
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Dr. Seak-Joon Lee
ITI, Korea
7. Power Device
Low Turn-on Voltage Silicon Carbide Diode
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Mr. Kyuheon Cho
On Semiconductor, Korea
GaN Power Devices for High Temperature and High Voltage Applications
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Dr. Hyung-Seok Lee
ETRI, Korea
4H-SiC Epitaxial Growth Technology for Large Area Substrate
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Dr. Han-Seok Seo
Research Inst. of Industrial Science
& Tech., Korea